Through-Hole Technology-IPC-610 Class III (Orient Semiconductor Electronics,Ltd.)
In the professional electronic foundry manufacturing service industry EMS, Orient Semiconductor Electronics. Ltd. (OSE) has become a global EMS manufacturer of electronic foundry manufacturing services, with unique technical experience and global reputation for high-mix manufacturing.
Through-Hole Technology-Strengthen Solder Joint by Increasing Vertical Fill
- IPC-610 Class III, (Military, Space)
- PTH Component, Minimum Acceptable Solder Conditions
Product Specs
Component Side Land Area Covered
- Class II & III No Need
- OSE’s Capability >95%
Circumferential Wetting
- Class II > 180 °
- Class III > 270 °
- OSE’s Capability 360 °
Vertical Fill
- Class II > 50% (≥14 leads)
- Class II > 75% (<14 leads)
- Class III > 75%
- OSE’s Capability 100%
The criteria of IPC-610 Class III, vertical fill is 75%, yet we’re able to achieve 100%.
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