Through-Hole Technology-IPC-610 Class III (Orient Semiconductor Electronics,Ltd.)

In the professional electronic foundry manufacturing service industry EMS, Orient Semiconductor Electronics. Ltd. (OSE) has become a global EMS manufacturer of electronic foundry manufacturing services, with unique technical experience and global reputation for high-mix manufacturing.

Through-Hole Technology-Strengthen Solder Joint by Increasing Vertical Fill

  • IPC-610 Class III, (Military, Space)
  • PTH Component, Minimum Acceptable Solder Conditions

Product Specs

Component Side Land Area Covered

  • Class II & III No Need
  •  OSE’s Capability >95%

Circumferential Wetting

  • Class II > 180 °
  • Class III > 270 °
  • OSE’s Capability 360 °

Vertical Fill

  • Class II > 50% (≥14 leads)
  • Class II > 75% (<14 leads)
  • Class III > 75%
  • OSE’s Capability  100%

The criteria of IPC-610 Class III, vertical fill is 75%, yet we’re able to achieve 100%.

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